Precision Soldering with Solder Ball Jetting System
The solder ball jetting laser soldering machine is ideal for the 3C (Computer, Communication, Consumer Electronics) industry, particularly for the precision soldering of miniature
Manual soldering method for BGA chips in optical modules
Manual soldering of BGA chips is a critical skill in optical module manufacturing. With careful preparation, precise placement, uniform heating, and thorough inspection, BGA soldering can
Placement and reflow of solder balls for FC, BGA, wafer-level-CSP
This permits individual removal and replacement of solder balls and solder contacts and allows to increase the yield and productivity of cost-intensive high end devices.
Soldering and Mounting Techniques Reference Manual
Dividing the larger die pads into smaller screen openings reduces the risk of solder voiding and allows the solder joints for the smaller terminal pads to be at the same height as the larger ones.
Automating Optoelectronics Soldering
The main purpose of this research project is to identify low-cost, high-yield, data-driven processes such as laser selective soldering and infra-red (IR) soldering to attach non-reflowable optoelectronic
Solderjet bumping for the assembly of micro-optical systems
The solder ball bumper integrates solder sphere feeding, reflow and placement of the solder bump as well as providing a localized inert nitrogen atmosphere in one singular and flexible to use device.
The Visual Inspection of Solder Balls in Semiconductor
We propose an approach to classify solder balls, in the soldering process of silicon wafers on Ball Grid Array (BGA), contained in the Printed Circuit Board (PCB) substrates.
Recommendations for board assembly of Infineon optical sensor
Soldering in a nitrogen atmosphere can generally improve the solder joint quality but is not necessary to create a reliable joint. Vapor phase or infrared (IR) soldering is not recommended.
Advanced Packaging Equipment Solder Jetting & Laser Bonding
Our laser solder jetting technology is clean, precise, and flexible. The singulation disc will dispense a single solder ball into the capillary where the laser beam''s thermal ener-gy melts the solder ball,
BGA Soldering Inspection Using AI
SolVision uses deep learning to analyze X-ray images for BGA soldering inspection. The AI model is trained with labeled defect data, including non-wetting, solder ball overlap, size deviations, and short
Soldering
The parts to be joined can be metallized with solder and solder-aiding layers by DC-magnetron sputtering. The coating technology of all layers takes place in one
Optical Power Meters & Sources
High-precision power meters (Ge/InGaAs) and stabilized light sources for insertion loss and return loss testing.
OTDR & Fiber Characterization
Full-featured OTDR, fiber OTDR testers, and modular OTDR test modules for network deployment and troubleshooting.
OSA & Eye Diagram Analyzer
High-resolution OSA for DWDM and eye diagram testers for signal integrity validation.
BERT & Endface Inspection
BERT up to 800G, fiber endface inspection probes, and extinction ratio meters for comprehensive testing.